Newsflash | From 3nm Mass Production to High-NA EUV Commercialization: The Vacuum Technology Battle Behind Advanced Nodes

Release time:

2026-06-10

Recently, ASML CEO Christophe Fouquet announced at the imec summit that the first batch of next-generation high-performance chips built with High-NA EUV lithography systems will be officially delivered within months. This device, priced at $400 million per unit and hailed as the "crown jewel of industry," transitioning from the lab to mass production, signals that the global semiconductor industry is advancing full-steam toward more cutting-edge process nodes.

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Newsflash | New Undergraduate Majors in Vacuum Engineering and Technology Approved, Industry Ushers in Golden Era of Development

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